System and Method for Information Handling System Thermal Diagnostics

ABSTRACT

Thermal subsystems of manufactured information handling systems are tested for compliance with desired parameters by running a thermal diagnostics module in firmware during one or more manufacturing activities performed on the information handling system. The thermal diagnostics module monitors and stores one or more thermal parameters detected at the information handling system, such as the maximum temperature zone detected during a manufacturing activity. The stored thermal parameter is read after the manufacturing activity and compared with an expected value to determine the status of the thermal subsystem. For instance, an information handling system maximum operating temperature is detected by firmware running on an embedded controller during imaging of a hard disk drive and fails thermal testing if the detected maximum operating temperature exceeds a predetermined value, such as a value that would not be reached if the thermal subsystem functioning properly.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates in general to the field of informationhandling system manufacture, and more particularly to a system andmethod for information handling system thermal diagnostics.

2. Description of the Related Art

As the value and use of information continues to increase, individualsand businesses seek additional ways to process and store information.One option available to users is information handling systems. Aninformation handling system generally processes, compiles, stores,and/or communicates information or data for business, personal, or otherpurposes thereby allowing users to take advantage of the value of theinformation. Because technology and information handling needs andrequirements vary between different users or applications, informationhandling systems may also vary regarding what information is handled,how the information is handled, how much information is processed,stored, or communicated, and how quickly and efficiently the informationmay be processed, stored, or communicated. The variations in informationhandling systems allow for information handling systems to be general orconfigured for a specific user or specific use such as financialtransaction processing, airline reservations, enterprise data storage,or global communications. In addition, information handling systems mayinclude a variety of hardware and software components that may beconfigured to process, store, and communicate information and mayinclude one or more computer systems, data storage systems, andnetworking systems.

Information handling systems are generally built from a large variety ofcomponents and subsystems. Manufacture of information handling systemsrelies on appropriate integration of these various components andsubsystems to function at a level deemed acceptable for an end-userenvironment. For example, thermal subsystems, such as the heat sinks,fans, thermal grease and other components involved in removing excessheat from an information handling system housing, generally must removeenough thermal energy to maintain components within an operatingtemperature range. If an information handling system thermal solutionfails to remove sufficient thermal energy, a variety of detrimentalimpacts will usually occur. For instance, cooling fans will tend to runat high speeds for extended time periods thus generating increaseoperating noise, excessive cooling fan wear, increased power consumptionand reduced internal battery life in the case of portable systems. Asanother example, automatic CPU throttling occurs with greater frequencyto reduce thermal output of the CPU, and also reducing systemperformance. In some situations, a thermal shutdown occurs iftemperatures become too extreme, resulting in data loss, user inquiriesto technical support, and increased warranty and repair costs.Additionally, information handling systems that run at highertemperatures are often uncomfortable to users to handle.

In order to avoid thermal subsystem difficulties, information handlingsystem manufacturers typically test each system for proper thermaloperation before shipping the systems to customers. One technique fortesting thermal subsystem operation is to run the information handlingsystem with the cooling fans forced off until the system reaches apredefined temperature and then forcing the cooling fans on again todetermine if the cooling fans cool the system to a predetermined reducedtemperature within a given time period. Properly operating thermalsubsystems will reach the reduced temperature in the set time whileinadequate thermal subsystems will fail to reach the reduced temperatureor take an excessive time period to do so. Although such testing ensuresthat the thermal subsystem meets minimum requirements, the time to runthe test often exceeds ten minutes, more that half of the time typicallyused to perform overall system testing. Increased testing time for eachsystem increases the number of testing racks needed for testing systemsas well as the power consumed by system testing. Further, testing ofthermal subsystems by forcing fans on and off does not mimic any actualend-user environment and thus does not represent a realistic view ofthermal performance.

SUMMARY OF THE INVENTION

Therefore a need has arisen for a system and method which more quicklyand efficiently tests information handling system thermal subsystemperformance.

In accordance with the present invention, a system and method areprovided which substantially reduce the disadvantages and problemsassociated with previous methods and systems for testing thermalsubsystem performance. A thermal diagnostics module operating infirmware monitors one or more thermal parameters of an informationhandling system during one or more manufacturing activities, such as themaximum temperature zone reached by the information handling system. Themonitored thermal parameter is compared with an expected value todetermine proper operation or failure of the thermal subsystem of theinformation handling system.

More specifically, a thermal diagnostics module is embedded in firmwareof a manufactured information handling system, such as in the embeddedcontroller. A thermal diagnostics engine of a manufacture rack enablesthe thermal diagnostics module to monitor thermal parameters of aninformation handling system for one or more manufacturing activities,such as during hardware diagnostics, during imaging and/or during finaldiagnostics. For instance, the thermal diagnostics module stores thehighest temperature zone reached during a manufacturing activity andprovides the stored value to the thermal diagnostics engine after themanufacturing activity is complete. The detected thermal parameter iscompared with an expected value for that information handling systemperforming the manufacturing activity to determine if the thermalsubsystem is operating correctly. If the detected value exceeds theexpected maximum value, the information handling system fails thethermal test while, if the detected value is less than the expectedmaximum value the information handling system passes the thermal testand may be shipped to an end user. Expected thermal parameter valuesare, for instance, determined with values measured from a properlyoperating system performing the manufacturing activity.

The present invention provides a number of important technicaladvantages. One example of an important technical advantage is thatbackground monitoring of thermal performance during other systemmanufacturing operations provides more realistic testing conditions andreduces manufacturing time by eliminating dedicated thermal performancetesting. For instance, tracking maximum temperature zone zones reachedduring image installation with the BIOS and comparing the measuredreadings with expected readings provides a closer comparison to end useroperating conditions than does operation with the cooling fan forcedoff. Thermal performance monitoring through BIOS firmware, such as amodule running on the embedded controller, operates without interferenceto the manufacture process. Reading the thermal performance from thefirmware after the manufacture process is complete takes minimal timeand has a greater likelihood of detecting thermal subsystem failuresthan does a dedicated thermal subsystem test that also takes anadditional ten minutes or more to perform.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention may be better understood, and its numerousobjects, features and advantages made apparent to those skilled in theart by referencing the accompanying drawings. The use of the samereference number throughout the several figures designates a like orsimilar element.

FIG. 1 depicts a block diagram of a system for background thermaldiagnostics during information handling system manufacture activities;

FIG. 2 depicts a flow diagram of a process for background thermaldiagnostics during information handling system manufacture activities;and

FIG. 3 depicts an information handling system manufacturing time linewith background thermal diagnostics.

DETAILED DESCRIPTION

Background monitoring of thermal parameters during information handlingsystem manufacture activities verifies proper operation of a thermalsubsystem without dedicated thermal testing. For purposes of thisdisclosure, an information handling system may include anyinstrumentality or aggregate of instrumentalities operable to compute,classify, process, transmit, receive, retrieve, originate, switch,store, display, manifest, detect, record, reproduce, handle, or utilizeany form of information, intelligence, or data for business, scientific,control, or other purposes. For example, an information handling systemmay be a personal computer, a network storage device, or any othersuitable device and may vary in size, shape, performance, functionality,and price. The information handling system may include random accessmemory (RAM), one or more processing resources such as a centralprocessing unit (CPU) or hardware or software control logic, ROM, and/orother types of nonvolatile memory. Additional components of theinformation handling system may include one or more disk drives, one ormore network ports for communicating with external devices as well asvarious input and output (I/O) devices, such as a keyboard, a mouse, anda video display. The information handling system may also include one ormore buses operable to transmit communications between the varioushardware components.

Referring now to FIG. 1, a block diagram depicts a system for backgroundthermal diagnostics during information handling system manufactureactivities. Information handling system 10 has an application layer 12,operating system layer 14 and a hardware layer 18. Hardware layer 18includes a number of components to process information, such as a CPU20, hard disk drive 22, RAM 24 chipset 26 and embedded controller 28. Inaddition, hardware layer 18 includes a thermal subsystem that removesexcess heat generated by operation of the hardware component, such as acooling fan 30 and heat sink 32. Cooling fan 30 forces a cooling airflowthrough the housing 34 than contains the components, especially acrossheat sink 32 which draws heat away from certain components, such as CPU20. Embedded controller 28 interfaces with cooling fan 30 to alter theoperating speed of cooling fan 30 as the temperature changes withinhousing 34. In addition, embedded controller and chipset 26 coordinatecommunication between various processing components and I/O devices,such as a keyboard and peripherals. For instance, firmware instructionssuch as in a BIOS 38 manage communications between processing componentsat a physical level and manage basic operating parameters, such as fanspeed to maintain a desired temperature. Operating system layer 14 runsover the firmware and hardware layers to interface application layer 12with desired computing resources.

Information handling systems 10 are built at a manufacture rack 40 byfirst assembling hardware components and then loading softwarecomponents, such as the operating system and applications. Once thehardware components are assembled, a hardware diagnostics module runhardware diagnostics to detect component failures. After proper hardwarecomponent operation is confirmed, an image engine 44 copies a softwareimage onto the assembled information handling system and sets the systemup to operate applications for end users. An application diagnosticsmodule 46 then runs final checks on the completed system to ensurecompatibility between the assembled hardware components and the loadedapplications. Completed systems are shipped to end users and typicallyserviced by the manufacturer through a warranty period. Identifyingsystem errors on a hardware, firmware or software level before systemsare shipped reduces warranty to cost and improves the customerexperience.

In order to confirm the proper operation of the thermal subsystem, athermal diagnostics engine 48 associated with manufacture rack 40interfaces with each manufactured information handling system 10.Thermal diagnostics engine 48 reads thermal parameters from eachinformation handling system 10 and compares the read thermal parameterswith expected thermal parameters found in an expected thermal parameterdatabase 50. The thermal parameters are monitored on each informationhandling system 10 with a thermal diagnostics module 52 operating infirmware layer 16, such as in conjunction with BIOS 38 on embeddedcontroller 28. Thermal diagnostics engine 48 enables thermal diagnosticsmodule 52 at the start of a predetermined manufacturing activity so thatthermal diagnostics module 52 operates in the background as themanufacturing activity takes place to monitor and store one or morethermal parameters. For instance, thermal diagnostics module 52 isinitiated at the application of power to information handling system 10to track maximum temperature zone reach in housing 34 during themanufacture process, including hardware diagnostics, image building andcompleted system diagnostics. Thermal diagnostics engine 48 reads themaximum temperature zone at the end of the manufacture process andcompares the detected maximum temperature zone with an expected maximumtemperature zone, such as the temperature reached by a similarinformation handling system with a properly operating thermal subsystem.If the expected maximum temperature zone is exceeded, the system failsand is sent for analysis while, if the expected maximum temperature zoneis not exceeded, the system passes and is shipped to the end user.Thermal diagnostics module 52 may track temperature during any or all ofthe hardware diagnostics, image building and application diagnostics,and may track other thermal parameters, such as cooling fan speed.

Referring now to FIG. 2, a flow diagram depicts a process for backgroundthermal diagnostics during information handling system manufactureactivities. The process begins at step 54 with the assembly of hardwarecomponents into an information handling system. At step 56, the thermaldiagnostics module is embedded in firmware of the information handlingsystem, such as with instructions saved to the embedded controller. Thethermal diagnostics module may be flashed as part of firmwareinstructions loaded to the assembled information handling system or maybe preloaded into the embedded controller before assembly of thecomponents. At step 58, the information handling system is powered upand at step 60 the thermal diagnostics module is enabled to monitorthermal parameters. The thermal diagnostics module is, for instance,enabled during a predetermined portion of the manufacture process sothat thermal parameters are detected and stored that correlate withexpected values taken from a properly-functioning system during similaractivities. At step 62, the manufacturing activity is performed and thethermal diagnostics module monitors thermal parameters during theactivity, such as the maximum temperature zone reached. At step 64 thethermal parameter is read from the thermal diagnostics module and, atstep 66, compared with an expected value. If, at step 68, the detectedthermal parameter does not exceed the expected value, the processcompletes at step 70 with the disabling of the thermal diagnosticsmodule. If at step 68 the detected thermal parameter exceeds an expectedvalue, the process continues to step 72 for failure of the thermal testby the system.

Referring now to FIG. 3, an information handling system manufacturingtime line with background thermal diagnostics is depicted. Theinformation handling system manufacture process begins at step 74 withthe building of hardware into an assembled information handling system.The assembled information handling system proceeds through hardwarediagnostics at step 76 to ensure proper operation of the hardware andimaging at step 78 to load software applications. At step 80, thecompleted system is subjected to final diagnostics before shipping to anend user to ensure compatibility and proper operation of the completedsoftware and hardware components. Monitoring of thermal parameters atstep 82 is performed during one or more of the manufacturing activities.For instance, hardware diagnostics, imaging and final diagnostics eachhave thermal parameters that are expected to be reached and may be usedto compare with detected thermal diagnostics by selecting the pointalong the manufacturing time line at which the thermal diagnosticsmodule is enabled and disable. Minimal if any interruption is introducedto the manufacturing activities by the monitoring of thermal parameterswith firmware running the background of the main activities, such asloading and testing applications with the CPU.

Although the present invention has been described in detail, it shouldbe understood that various changes, substitutions and alterations can bemade hereto without departing from the spirit and scope of the inventionas defined by the appended claims.

1-7. (canceled)
 8. A process for testing an information handling systemthermal subsystem during manufacture of the information handling system,the method comprising: assembling hardware components into aninformation handling system, the components operable to processinformation at least in part under the control of firmware, thecomponents including a thermal subsystem; embedding a thermaldiagnostics module in firmware of the information handling system;powering up the information handling system; performing one or moremanufacturing activities on the information handling system; monitoringone or more thermal parameters with the thermal diagnostics moduleduring the manufacturing activity; storing at least some of the thermalparameters; reading the stored thermal parameters after completion ofthe manufacturing activity; and comparing the monitored thermalparameters with expected thermal parameters to determine either correctoperation or failure of the thermal subsystem.
 9. The process of claim 8further comprising: disabling the thermal diagnostics module after adetermination of correct operation of the thermal subsystem.
 10. Theprocess of claim 8 wherein embedding a thermal diagnostics modulefurther comprises embedding the module in a BIOS of the informationhandling system.
 11. The process of claim 8 wherein monitoring furthercomprises monitoring the maximum temperature zone reached within theinformation handling system during the manufacturing activity.
 12. Themethod of claim 8 wherein the manufacturing activity comprises runningdiagnostics on hardware loaded in the information handling system. 13.The method of claim 8 wherein the manufacturing activity comprisescopying an image to a hard disk drive of the information handlingsystem.
 14. The method of claim 8 wherein the manufacturing activitycomprises running diagnostics on applications loaded in the informationhandling system. 15-20. (canceled)